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"An optimized through-via bottom-up method for simultaneous-filling TSVS of ..."

Weibo Zhang et al. (2020)

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DOI: 10.1016/J.MEJO.2020.104798

access: closed

type: Journal Article

metadata version: 2020-07-10

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  - https://dblp.org/rec/journals/mj/ZhangGXLL20
Weibo Zhang, Jiebin Gu, Gaowei Xu, Le Luo, Xinxin Li:
An optimized through-via bottom-up method for simultaneous-filling TSVS of different aspect-ratios and its potential application on high-frequency passive interposer. Microelectron. J. 101: 104798 (2020)

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