"Stress analysis and optimization of QFN solder joints under ..."

Jisheng Wei et al. (2025)

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DOI: 10.1016/J.MEJO.2025.106661

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type: Journal Article

metadata version: 2025-04-29

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Jisheng Wei, Chunyue Huang, Chao Gao, Gui Wang:
Stress analysis and optimization of QFN solder joints under bending-torsion coupled conditions based on the SSA. Microelectron. J. 159: 106661 (2025)

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