"Study and improvement of electrical performance of 130 nm Cu/CVD low k ..."

C. F. Tsang, V. N. Bliznetsov, Y. J. Su (2003)

> Home

Details and statistics

DOI: 10.1016/J.MEJO.2003.09.005

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mj/TsangBS03
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mj/TsangBS03
C. F. Tsang, V. N. Bliznetsov, Y. J. Su:
Study and improvement of electrical performance of 130 nm Cu/CVD low k SiOCH interconnect related to via etch process. Microelectron. J. 34(11): 1051-1058 (2003)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.