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"Analytical equivalent circuit modeling and analysis of complex BGA for 3D ..."

Lei Tang et al. (2024)

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DOI: 10.1016/J.MEJO.2023.106027

access: closed

type: Journal Article

metadata version: 2024-01-26

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Lei Tang, Kangrong Li, Xingshe Zhou, Qiao Yang, Penghui Pan, Daowei Wu, Baoxia Li, Yanling Wang, Nailiang Kuang, Liaoliao Zhang:
Analytical equivalent circuit modeling and analysis of complex BGA for 3D silicon-interposer packaging. Microelectron. J. 143: 106027 (2024)

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