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"Thermal investigation of LED array with multiple packages based on the ..."

Dong Shi et al. (2015)

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DOI: 10.1016/J.MEJO.2015.03.010

access: closed

type: Journal Article

metadata version: 2023-03-15

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Dong Shi, Shiwei Feng, Yamin Zhang, Yanbin Qiao, Bing Deng:
Thermal investigation of LED array with multiple packages based on the superposition method. Microelectron. J. 46(7): 632-636 (2015)

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