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"Fine grain thermal modeling and experimental validation of 3D-ICs."
Herman Oprins et al. (2011)
- Herman Oprins, Adi Srinivasan
, Miroslav Cupák, Vladimir Cherman, Cristina Torregiani, Michele Stucchi, Geert Van der Plas, Paul Marchal, Bart Vandevelde, E. Cheng:
Fine grain thermal modeling and experimental validation of 3D-ICs. Microelectron. J. 42(4): 572-578 (2011)
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