"Evaluation of analytical models for thermal analysis and design of ..."

Saeed Moghaddam et al. (2003)

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DOI: 10.1016/S0026-2692(02)00192-1

access: closed

type: Journal Article

metadata version: 2024-10-06

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Saeed Moghaddam, M. Rada, Amir Shooshtari, M. Ohadi, Y. Joshi:
Evaluation of analytical models for thermal analysis and design of electronic packages. Microelectron. J. 34(3): 223-230 (2003)

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