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"Simulation and reliability testing of leadless package high-temperature ..."

Zhong Jin et al. (2022)

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DOI: 10.1016/J.MEJO.2022.105568

access: closed

type: Journal Article

metadata version: 2022-12-09

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Zhong Jin, Junwang Tian, Xin Tang, Junhui Li:
Simulation and reliability testing of leadless package high-temperature pressure sensor. Microelectron. J. 129: 105568 (2022)

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