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"The peculiarities of mechanical bending of silicon wafers after diverse ..."

H. Bidadi et al. (2003)

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DOI: 10.1016/S0026-2692(03)00100-9

access: closed

type: Journal Article

metadata version: 2020-02-22

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H. Bidadi, S. Sobhanian, M. Mazidi, Sh. Hasanli, S. Khorram:
The peculiarities of mechanical bending of silicon wafers after diverse manufacturing operations. Microelectron. J. 34(5-8): 515-519 (2003)

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