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"Experimental characterization of coaxial through silicon vias for 3D ..."

Stephen Adamshick, Douglas Coolbaugh, Michael Liehr (2015)

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DOI: 10.1016/J.MEJO.2015.02.011

access: closed

type: Journal Article

metadata version: 2020-02-22

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Stephen Adamshick, Douglas Coolbaugh, Michael Liehr:
Experimental characterization of coaxial through silicon vias for 3D integration. Microelectron. J. 46(5): 377-382 (2015)

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