"Liquid-Metal Vertical Interconnects for Flip Chip Assembly of GaAs C-Band ..."

Parrish Ralston et al. (2012)

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DOI: 10.1109/JSSC.2012.2204930

access: closed

type: Journal Article

metadata version: 2023-11-12

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Parrish Ralston, Marcus Oliver, Krishna Vummidi, Sanjay Raman:
Liquid-Metal Vertical Interconnects for Flip Chip Assembly of GaAs C-Band Power Amplifiers Onto Micro-Rectangular Coaxial Transmission Lines. IEEE J. Solid State Circuits 47(10): 2327-2334 (2012)

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