"A survey of optimization techniques for thermal-aware 3D processors."

Kun Cao et al. (2019)

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DOI: 10.1016/J.SYSARC.2019.01.003

access: closed

type: Journal Article

metadata version: 2025-05-19

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Kun Cao, Junlong Zhou, Tongquan Wei, Mingsong Chen, Shiyan Hu, Keqin Li:
A survey of optimization techniques for thermal-aware 3D processors. J. Syst. Archit. 97: 397-415 (2019)

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