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"Shape Measurement of Solder Bumps by Shape-from-Focus Using Varifocal Mirror."

Jun Mitsudo, Akira Ishii (2006)

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DOI: 10.20965/JRM.2006.P0722

access: closed

type: Journal Article

metadata version: 2020-04-01

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  - https://dblp.org/rec/journals/jrm/MitsudoI06
Jun Mitsudo, Akira Ishii:
Shape Measurement of Solder Bumps by Shape-from-Focus Using Varifocal Mirror. J. Robotics Mechatronics 18(6): 722-727 (2006)

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