"A methodology for thermal simulation of interconnects enabled by model ..."

Wangkun Jia, Ming-C. Cheng (2022)

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DOI: 10.1016/J.JOCS.2022.101665

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type: Journal Article

metadata version: 2022-07-07

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Wangkun Jia, Ming-C. Cheng:
A methodology for thermal simulation of interconnects enabled by model reduction with material property variation. J. Comput. Sci. 61: 101665 (2022)

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