"SkyBridge 2.0: A Fine-grained Vertical 3D-IC Technology for Future ICs."

Sachin Bhat et al. (2023)

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DOI: 10.1145/3617501

access: closed

type: Journal Article

metadata version: 2023-12-31

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Sachin Bhat, Mingyu Li, Sourabh Kulkarni, Csaba Andras Moritz:
SkyBridge 2.0: A Fine-grained Vertical 3D-IC Technology for Future ICs. ACM J. Emerg. Technol. Comput. Syst. 19(4): 33:1-33:19 (2023)

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