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"Thermal-Aware Task Scheduling for 3D-Network-on-Chip: A Bottom to Top Scheme."

Yingnan Cui et al. (2016)

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DOI: 10.1142/S021812661640003X

access: closed

type: Journal Article

metadata version: 2021-10-14

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  - journals/jcsc/CuiZCLH16
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  persistent URL:
  - https://dblp.org/rec/journals/jcsc/CuiZCLH16
Yingnan Cui, Wei Zhang, Vivek Chaturvedi, Weichen Liu, Bingsheng He:
Thermal-Aware Task Scheduling for 3D-Network-on-Chip: A Bottom to Top Scheme. J. Circuits Syst. Comput. 25(1): 1640003:1-1640003:20 (2016)

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