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"PCB thermal reliability characteristics analysis under ambient temperature."

Hailong Huang, Yi Wan, Kai Zhou (2020)

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DOI: 10.3233/JCM-194033

access: closed

type: Journal Article

metadata version: 2020-10-08

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  - https://dblp.org/rec/journals/jcmse/HuangWZ20
Hailong Huang, Yi Wan, Kai Zhou:
PCB thermal reliability characteristics analysis under ambient temperature. J. Comput. Methods Sci. Eng. 20(3): 853-858 (2020)

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