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"Large-Scale 3D Chips: Challenges and Solutions for Design Automation, ..."

Johann Knechtel et al. (2017)

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DOI: 10.2197/IPSJTSLDM.10.45

access: closed

type: Journal Article

metadata version: 2023-03-21

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Johann Knechtel, Ozgur Sinanoglu, Ibrahim Abe M. Elfadel, Jens Lienig, Cliff C. N. Sze:
Large-Scale 3D Chips: Challenges and Solutions for Design Automation, Testing, and Trustworthy Integration. IPSJ Trans. Syst. LSI Des. Methodol. 10: 45-62 (2017)

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