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"A 6.4-Gbps 0.41-pJ/b fully-digital die-to-die interconnect PHY for silicon ..."

Yinglin Yang et al. (2024)

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DOI: 10.1016/J.VLSI.2024.102170

access: closed

type: Journal Article

metadata version: 2024-08-04

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Yinglin Yang, Yunzhengmao Wang, Tengyue Yi, Chixiao Chen, Qi Liu:
A 6.4-Gbps 0.41-pJ/b fully-digital die-to-die interconnect PHY for silicon interposer based 2.5D integration. Integr. 96: 102170 (2024)

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