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"Finite element analysis on stress/strain in CBGA solder joint with ..."

Yang Ping, Caijun Shen (2009)

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DOI: 10.1504/IJMTM.2009.026393

access: closed

type: Journal Article

metadata version: 2020-06-04

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  - https://dblp.org/rec/journals/ijmtm/PingS09
Yang Ping, Caijun Shen:
Finite element analysis on stress/strain in CBGA solder joint with different substrates under thermal cycle. Int. J. Manuf. Technol. Manag. 18(3): 333-339 (2009)

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