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"Nondestructive Inline Inspection of Through-Silicon Vias Based on X-Ray ..."

Yasutoshi Umehara, Nobuyuki Moronuki (2019)

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DOI: 10.20965/IJAT.2019.P0289

access: closed

type: Journal Article

metadata version: 2020-07-09

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  - https://dblp.org/rec/journals/ijat/UmeharaM19
Yasutoshi Umehara, Nobuyuki Moronuki:
Nondestructive Inline Inspection of Through-Silicon Vias Based on X-Ray Imaging and its Uncertainty Budget. Int. J. Autom. Technol. 13(2): 289-300 (2019)

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