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"Towards IP integration on SoC: a case study of high-throughput and ..."

Xiaokun Yang et al. (2020)

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DOI: 10.1049/IET-CDT.2019.0090

access: closed

type: Journal Article

metadata version: 2022-01-03

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  - https://dblp.org/rec/journals/iet-cdt/YangSUL20
Xiaokun Yang, Shi Sha, Ishaq Unwala, Jiang Lu:
Towards IP integration on SoC: a case study of high-throughput and low-cost wrapper design on a novel IBUS architecture. IET Comput. Digit. Tech. 14(6): 353-362 (2020)

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