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"Co-design of micro-fluidic heat sink and thermal through-silicon-vias for ..."
Bing Shi, Ankur Srivastava, Avram Bar-Cohen (2013)
- Bing Shi, Ankur Srivastava, Avram Bar-Cohen:
Co-design of micro-fluidic heat sink and thermal through-silicon-vias for cooling of three-dimensional integrated circuit. IET Circuits Devices Syst. 7(5): 223-231 (2013)
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