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"Co-design of micro-fluidic heat sink and thermal through-silicon-vias for ..."

Bing Shi, Ankur Srivastava, Avram Bar-Cohen (2013)

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DOI: 10.1049/IET-CDS.2013.0026

access: closed

type: Journal Article

metadata version: 2021-11-18

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Bing Shi, Ankur Srivastava, Avram Bar-Cohen:
Co-design of micro-fluidic heat sink and thermal through-silicon-vias for cooling of three-dimensional integrated circuit. IET Circuits Devices Syst. 7(5): 223-231 (2013)

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