"An Optimization Mechanism for Mid-Bond Testing of TSV-Based 3D SoCs."

Kele Shen, Zhigang Yu, Zhou Jiang (2016)

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DOI: 10.1587/TRANSELE.E99.C.308

access: closed

type: Journal Article

metadata version: 2020-04-11

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  - https://dblp.org/rec/journals/ieicet/ShenYJ16
Kele Shen, Zhigang Yu, Zhou Jiang:
An Optimization Mechanism for Mid-Bond Testing of TSV-Based 3D SoCs. IEICE Trans. Electron. 99-C(2): 308-315 (2016)

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