"A 1.2 Gbps Non-contact 3D-Stacked Inter-Chip Data Communications Technology."

Daisuke Mizoguchi et al. (2006)

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DOI: 10.1093/IETELE/E89-C.3.320

access: closed

type: Journal Article

metadata version: 2020-04-11

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Daisuke Mizoguchi, Noriyuki Miura, Takayasu Sakurai, Tadahiro Kuroda:
A 1.2 Gbps Non-contact 3D-Stacked Inter-Chip Data Communications Technology. IEICE Trans. Electron. 89-C(3): 320-326 (2006)

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