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ORCID"High-Frequency and Integrated Design Based on Flip-Chip Interconnection ..."
Shigeru Kanazawa et al. (2019)
- Shigeru Kanazawa, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi
, Yoshihiro Ogiso, Johsuke Ozaki, Takahiko Shindo, Satoshi Tsunashima, Hiromasa Tanobe, Atsushi Araratake:
High-Frequency and Integrated Design Based on Flip-Chip Interconnection Technique (Hi-FIT) for High-Speed (>100 Gbaud) Optical Devices. IEICE Trans. Electron. 102-C(4): 340-346 (2019)
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