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"Temperature-Aware Layer Assignment for Three-Dimensional Integrated Circuits."

Shih-Hsu Huang, Hua-Hsin Yeh (2014)

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DOI: 10.1587/TRANSFUN.E97.A.1699

access: closed

type: Journal Article

metadata version: 2020-04-11

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  persistent URL:
  - https://dblp.org/rec/journals/ieicet/HuangY14
Shih-Hsu Huang, Hua-Hsin Yeh:
Temperature-Aware Layer Assignment for Three-Dimensional Integrated Circuits. IEICE Trans. Fundam. Electron. Commun. Comput. Sci. 97-A(8): 1699-1708 (2014)

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