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"Electrical analysis of TSV step change in radius with compensation structure."

Junping Zheng et al. (2015)

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DOI: 10.1587/ELEX.12.20150400

access: open

type: Journal Article

metadata version: 2021-02-12

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  - electronic edition via DOI (open access)
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  dblp key:
  - journals/ieiceee/ZhengDYZF15
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  persistent URL:
  - https://dblp.org/rec/journals/ieiceee/ZhengDYZF15
Junping Zheng, Gang Dong, Yintang Yang, Yingbo Zhao, Qingyang Fan:
Electrical analysis of TSV step change in radius with compensation structure. IEICE Electron. Express 12(12): 20150400 (2015)

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