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ORCID"Analytical models for the thermal strain and stress induced by annular ..."
Fengjuan Wang et al. (2013)
- Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding:
Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV). IEICE Electron. Express 10(20): 20130666 (2013)
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