"Analytical models for the thermal strain and stress induced by annular ..."

Fengjuan Wang et al. (2013)

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DOI: 10.1587/ELEX.10.20130666

access: open

type: Journal Article

metadata version: 2021-02-12

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  - https://dblp.org/rec/journals/ieiceee/WangZYLD13
Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding:
Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV). IEICE Electron. Express 10(20): 20130666 (2013)

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