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"Edge plating for building large arrays and low-inductance board-to-board ..."

Junho Park, Dong Gun Kam (2018)

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DOI: 10.1587/ELEX.15.20180953

access: open

type: Journal Article

metadata version: 2021-02-12

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  dblp key:
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  - https://dblp.org/rec/journals/ieiceee/ParkK18
Junho Park, Dong Gun Kam:
Edge plating for building large arrays and low-inductance board-to-board connection. IEICE Electron. Express 15(24): 20180953 (2018)

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