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ORCID"Transient thermal analysis of packaged SiC SBDs for high temperature ..."
Taehwa Kim, Tsuyoshi Funaki (2016)
- Taehwa Kim, Tsuyoshi Funaki:
Transient thermal analysis of packaged SiC SBDs for high temperature operation. IEICE Electron. Express 13(6): 20151047 (2016)
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