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ORCID"Capacitive pressure sensor with wafer-through silicon vias using SOI-Si ..."
Jun-Ku Kim, Chang-Wook Baek (2013)
- Jun-Ku Kim, Chang-Wook Baek:
Capacitive pressure sensor with wafer-through silicon vias using SOI-Si direct wafer bonding and glass reflow technique. IEICE Electron. Express 10(15): 20130453 (2013)
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