"An integrated packaging hybrid power supply modulator for transmitter systems."

Xingli Cui et al. (2024)

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DOI: 10.1587/ELEX.20.20230502

access: open

type: Journal Article

metadata version: 2024-05-18

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  - https://dblp.org/rec/journals/ieiceee/CuiQLLZLHX24
Xingli Cui, Xin Qiu, Yongqing Leng, Xiaotian Liu, Shiyu Zuo, Yongzhou Li, Aizhen Hu, Bo Xu:
An integrated packaging hybrid power supply modulator for transmitter systems. IEICE Electron. Express 21(1): 20230502 (2024)

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