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"Development of next-generation system-on-package (SOP) technology based on ..."

John U. Knickerbocker et al. (2005)

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DOI: 10.1147/RD.494.0725

access: closed

type: Journal Article

metadata version: 2020-03-13

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  - journals/ibmrd/KnickerbockerABDHJKMPPSSSSTWWMSD05
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John U. Knickerbocker, Paul S. Andry, L. Paivikki Buchwalter, Alina Deutsch, Raymond R. Horton, Keith A. Jenkins, Young Hoon Kwark, Gerald McVicker, Chirag S. Patel, Robert J. Polastre, Christian D. Schuster, Arun Sharma, Sri M. Sri-Jayantha, Christopher W. Surovic, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright, Samuel R. McKnight, Edmund J. Sprogis, Bing Dang:
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. IBM J. Res. Dev. 49(4-5): 725-754 (2005)

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