"Microstructure and mechanical properties of lead-free solders and solder ..."

Sung K. Kang et al. (2005)

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DOI: 10.1147/RD.494.0607

access: closed

type: Journal Article

metadata version: 2020-03-13

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Sung K. Kang, Paul Lauro, Da-Yuan Shih, Donald W. Henderson, Karl J. Puttlitz:
Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications. IBM J. Res. Dev. 49(4-5): 607-620 (2005)

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