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"Through-silicon vias enable next-generation SiGe power amplifiers for ..."

Alvin J. Joseph et al. (2008)

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DOI: 10.1147/JRD.2008.5388563

access: closed

type: Journal Article

metadata version: 2020-12-18

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  - https://dblp.org/rec/journals/ibmrd/JosephGDLPMWEDGMD08
Alvin J. Joseph, John D. Gillis, Mark Doherty, Peter J. Lindgren, Rosemary A. Previti-Kelly, Ramana M. Malladi, Ping-Chuan Wang, Mete Erturk, Hanyi Ding, Ephrem G. Gebreselasie, Michael J. McPartlin, James S. Dunn:
Through-silicon vias enable next-generation SiGe power amplifiers for wireless communications. IBM J. Res. Dev. 52(6): 635-648 (2008)

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