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ORCID"Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost."
Mottaqiallah Taouil et al. (2012)
- Mottaqiallah Taouil, Said Hamdioui, Kees Beenakker, Erik Jan Marinissen
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Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost. J. Electron. Test. 28(1): 15-25 (2012)
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