"Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect ..."

Valeriy Sukharev et al. (2012)

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DOI: 10.1007/S10836-011-5259-Y

access: closed

type: Journal Article

metadata version: 2020-09-11

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Valeriy Sukharev, Armen Kteyan, Jun-Ho Choy, Henrik Hovsepyan, Ara Markosian, Ehrenfried Zschech, Rene Huebner:
Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect of Die Stacking on Device Performance. J. Electron. Test. 28(1): 63-72 (2012)

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