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"Detection and Diagnosis of Multi-Fault for through Silicon Vias in 3D IC."

Yuling Shang et al. (2020)

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DOI: 10.1007/S10836-020-05916-Y

access: closed

type: Journal Article

metadata version: 2021-02-05

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  - https://dblp.org/rec/journals/et/ShangTLFZ20
Yuling Shang, Weipeng Tan, Chunquan Li, Haihua Fan, Lizhen Zeng:
Detection and Diagnosis of Multi-Fault for through Silicon Vias in 3D IC. J. Electron. Test. 36(6): 771-783 (2020)

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