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"Test of Mechanical Failure for Via Holes and Solder Joints of Complex ..."

Yuling Shang et al. (2017)

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DOI: 10.1007/S10836-017-5675-8

access: closed

type: Journal Article

metadata version: 2021-02-05

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Yuling Shang, Liyuan Sun, Chunquan Li, Jianfeng Ma:
Test of Mechanical Failure for Via Holes and Solder Joints of Complex Interconnect Structure. J. Electron. Test. 33(4): 491-499 (2017)

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