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"Effects of Copper Plasticity on the Induction of Stress in Silicon from ..."

Benjamin Backes et al. (2012)

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DOI: 10.1007/S10836-011-5242-7

access: closed

type: Journal Article

metadata version: 2020-09-11

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Benjamin Backes, Colin McDonough, Larry Smith, Wei Wang, Robert E. Geer:
Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits. J. Electron. Test. 28(1): 53-62 (2012)

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