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ORCID"Design Challenges in 3-D SoC Stacked With a 12.8 GB/s TSV Wide I/O DRAM."
Takao Nomura et al. (2016)
- Takao Nomura, Ryo Mori, Koji Takayanagi, Kazuki Fukuoka, Koji Nii:
Design Challenges in 3-D SoC Stacked With a 12.8 GB/s TSV Wide I/O DRAM. IEEE J. Emerg. Sel. Topics Circuits Syst. 6(3): 364-372 (2016)
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