"Wafer-Package Test Mix for Optimal Defect Detection and Test Time Savings."

Peter C. Maxwell (2003)

> Home

Details and statistics

DOI: 10.1109/MDT.2003.1232260

access: closed

type: Journal Article

metadata version: 2020-05-17

- view
  authority control:
- export record
  dblp key:
  - journals/dt/Maxwell03
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/dt/Maxwell03
Peter C. Maxwell:
Wafer-Package Test Mix for Optimal Defect Detection and Test Time Savings. IEEE Des. Test Comput. 20(5): 84-89 (2003)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.