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"Demystifying 3D ICs: The Pros and Cons of Going Vertical."

W. Rhett Davis et al. (2005)

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DOI: 10.1109/MDT.2005.136

access: closed

type: Journal Article

metadata version: 2022-01-03

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  persistent URL:
  - https://dblp.org/rec/journals/dt/DavisWMXHMSSF05
W. Rhett Davis, John M. Wilson, Stephen E. Mick, Jian Xu, Hao Hua, Christopher Mineo, Ambarish M. Sule, Michael B. Steer, Paul D. Franzon:
Demystifying 3D ICs: The Pros and Cons of Going Vertical. IEEE Des. Test Comput. 22(6): 498-510 (2005)

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