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"A new COP bonding using non-conductive adhesives for LCDs driver IC packaging."

Zhi Gang Chen, Young-Ho Kim (2006)

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DOI: 10.1016/J.DISPLA.2006.04.002

access: closed

type: Journal Article

metadata version: 2017-05-17

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  - journals/displays/ChenK06
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  - https://dblp.org/rec/journals/displays/ChenK06
Zhi Gang Chen, Young-Ho Kim:
A new COP bonding using non-conductive adhesives for LCDs driver IC packaging. Displays 27(3): 130-135 (2006)

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