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"US Microelectronics Packaging Ecosystem: Challenges and Opportunities."

Rouhan Noor et al. (2023)

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DOI: 10.48550/ARXIV.2310.11651

access: open

type: Informal or Other Publication

metadata version: 2023-11-02

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  - journals/corr/abs-2310-11651
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  - https://dblp.org/rec/journals/corr/abs-2310-11651
Rouhan Noor, Himanandhan Reddy Kottur, Patrick J. Craig, Liton Kumar Biswas, M. Shafkat M. Khan, Nitin Varshney, Hamed Dalir, Elif Akçali, Bahar Ghane Motlagh, Charles Woychik, Yong-Kyu Yoon, Navid Asadizanjani:
US Microelectronics Packaging Ecosystem: Challenges and Opportunities. CoRR abs/2310.11651 (2023)

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