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"A Methodology for Thermal Simulation of Interconnects Enabled by Model ..."

Wangkun Jia, Ming-C. Cheng (2021)

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DOI: —

access: open

type: Informal or Other Publication

metadata version: 2021-12-08

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  - electronic edition @ arxiv.org (open access)
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  dblp key:
  - journals/corr/abs-2112-03023
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  persistent URL:
  - https://dblp.org/rec/journals/corr/abs-2112-03023
Wangkun Jia, Ming-C. Cheng:
A Methodology for Thermal Simulation of Interconnects Enabled by Model Reduction with Material Property Variation. CoRR abs/2112.03023 (2021)

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