"MCM: The High-Performance Electronic Packaging Technology."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

P. R. Mukund, John F. McDonald (1993)

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DOI: 10.1109/MC.1993.10038

access: closed

type: Journal Article

metadata version: 2024-03-02

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P. R. Mukund, John F. McDonald:
MCM: The High-Performance Electronic Packaging Technology. Computer 26(4): 10-12 (1993)

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