"Wafer Scale Interconnections for GaAs Packing - Applications to RISC ..."

John F. McDonald et al. (1987)

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DOI: 10.1109/MC.1987.1663533

access: closed

type: Journal Article

metadata version: 2025-02-24

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John F. McDonald, Hans J. Greub, Randy H. Steinvorth, Brian J. Donlan, Albert S. Bergendahl:
Wafer Scale Interconnections for GaAs Packing - Applications to RISC Architecture. Computer 20(4): 21-35 (1987)

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