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"A physics-based electromigration reliability model for interconnects ..."

Linlin Cai et al. (2021)

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DOI: 10.1007/S11432-020-3140-4

access: closed

type: Journal Article

metadata version: 2021-12-29

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Linlin Cai, Wangyong Chen, Jinfeng Kang, Gang Du, Xiaoyan Liu, Xing Zhang:
A physics-based electromigration reliability model for interconnects lifetime prediction. Sci. China Inf. Sci. 64(11) (2021)

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